Symposium on Solid and Physical Modeling (SPM 2025)

Shape Modeling International (SMI 2025)

Oct.29——Nov.2, 2025

Hangzhou, China

☞ Registration is open!

Conference Introduction

The Symposium on Solid and Physical Modeling (SPM) is a leading international conference on computer-aided design and physics-based modeling. In 2025, SPM will be co-located with Shape Modeling International (SMI 2025) in Hangzhou, Zhejiang, P.R. China. SPM 2025 will cover all aspects of geometric and physical modeling, along with their applications in design, analysis, and manufacturing, as well as in fields such as biomedicine, geophysics, and digital entertainment. The conference will also present the Bézier Award, recognizing outstanding contributions to the fields of solid, shape, and physical modeling.

实体物理建模国际会议(SPM)是计算机辅助设计和物理建模领域的国际领先学术会议。2025 年,SPM 将与形状建模国际会议(SMI 2025)联合举办,会议地点为中国浙江杭州。SPM 2025 将涵盖几何建模与物理建模的各个方面,以及它们在设计、分析和制造等领域中的应用,此外还包括生物医学、地球物理和数字娱乐等相关领域。大会还将颁发 the Bézier Award,以表彰在实体建模、形状建模和物理建模领域做出杰出贡献。

SPM Program Committee

Shimin Hu

Advisory Co-Chairs
Tsinghua University, China

Hujun Bao

Advisory Co-Chairs
Zhejiang University, China

Qing Wu

Advisory Co-Chairs
Hangzhou Dianzi University, China

Georges-Pierre Bonneau

SMI&SPM Conference Chairs
Université Grenoble Alpes, France

Weiwei Xu

General Co-Chairs
Zhejiang University, China

Gang Xu

General Co-Chairs
Hangzhou Dianzi University, China

Yunbo Zhang

Program Co-Chairs
Rochester Institute of Technology, USA

Xiaohu Guo

Program Co-Chairs
The University of Texas at Dallas, USA

Lucia Romani

Program Co-Chairs
Università di Bologna, Italy

Qiang Zou

Local Coordinator (Area Chair)
Zhejiang University, China

Jinlan Xu

Local Coordinator (Area Chair)
Hangzhou Dianzi University, China
  • Ergun Akleman (Texas A&M University)
  • Michael Barton (BCAM)
  • Silvia Biasotti (IMATI-CNR)
  • Pengbo Bo (Harbin Institute of Technology)
  • Georges-Pierre Bonneau (University of Grenoble and INRIA)
  • Laurent Buse (INRIA)
  • Marcel Campen (Osnabrück University)
  • Juan Cao (Xiamen University)
  • Frederic Cazals (INRIA)
  • Falai Chen (Department of Mathematics, University of Science and Technology of China)
  • Renjie Chen (University of Science and Technology of China)
  • Zhonggui Chen (Xiamen University)
  • Bailin Deng (Cardiff University)
  • Chongyang Deng (Hangzhou Dianzi University)
  • Tor Dokken (SINTEF)
  • Gershon Elber (Technion- Israel Institute of Technology)
  • Guoxin Fang (The Chinese University of Hong Kong)
  • Xiao-Ming Fu (University of Science and Technology of China)
  • Shuming Gao (38 Zheda Rd,Hangzhou,Zhejiang Province,P.R.China)
  • Xiaohu Guo (The University of Texas at Dallas)
  • Stefanie Hahmann (University of Grenoble)
  • George Harabin (Palo Alto Research Center)
  • Kai Hormann (University of Lugano)
  • Jin Huang (Zhejiang University)
  • Tao Ju (Washington University in St. Louis)
  • Bert Juettler (Johannes Kepler University)
  • Mario Kapl (Department of Engineering & IT, Carinthia University of Applied Sciences)
  • Jiri Kosinka (University of Groningen)
  • Vinayak Krishnamurthy (Texas A&M University)
  • Adarsh Krishnamurthy (Iowa State University)
  • Miroslav Lavicka (UWB Plzen)
  • Xin Li (Texas A&M University)
  • Ligang Liu (University of Science and Technology of China)
  • Shengjun Liu (Central South University)
  • Xingchen Liu (University of California Berkeley)
  • Yang Liu (Microsoft)
  • Marco Livesu (IMATI CNR)
  • Lin Lu (Shandong University)
  • Weiyin Ma (City University of Hong Kong)
  • Stephen Mann (University of Waterloo)
  • Scott Mitchell (Sandia National Laboratories)
  • Bernard Mourrain (INRIA)
  • Jean-Philippe Pernot (Arts et Métiers ParisTech)
  • Jorg Peters (University of Florida)
  • Konrad Polthier (Freie Universität Berlin)
  • Hong Qin (Stony Brook University)
  • Lucia Romani (University of Bologna)
  • Scott Schaefer (Texas A&M University)
  • Hyewon Seo (ICube - University of Strasbourg)
  • Vadim Shapiro (University of California Berkeley)
  • Peng Song (Singapore University of Technology and Design)
  • Jean-Marc Thiery (Adobe Research)
  • Yiying Tong (Michigan State University)
  • Bin Wang (Tsinghua University)
  • Charlie Wang (Delft University of Technology)
  • Jun Wu (Delft University of Technology)
  • Gang Xu (Hangzhou Dianzi University)
  • Weiwei Xu (Zhejiang University)
  • Chuhua Xian (The South China University of Technology)
  • Yongliang Yang (University of Bath)
  • Yunbo Zhang (Rochester Institute of Technology)
  • Jessica Zhang (Carnegie Mellon University)
  • Jianmin Zheng (Nanyang Technological University)
  • Gang Zhao (Tsinghua University)
  • Yuanfeng Zhou (Shandong University)
  • Zichun Zhong (Wayne State University)
  • Qiang Zou (Zhejiang University)

SMI Program Committee

Shimin Hu

Advisory Co-Chairs
Tsinghua University, China

Hujun Bao

Advisory Co-Chairs
Zhejiang University, China

Qing Wu

Advisory Co-Chairs
Hangzhou Dianzi University, China

Georges-Pierre Bonneau

SMI&SPM Conference Chairs
Université Grenoble Alpes, France

Weiwei Xu

SMI&SPM Conference Chairs
Zhejiang University, China

Gang Xu

SMI&SPM Conference Chairs
Hangzhou Dianzi University, China

Hongwei Lin

SMI Technical Paper Chairs
Zhejiang University, China

Michela Mortara

SMI Technical Paper Chairs
CNR-IMATI Genova, Italy

Zichun Zhong

SMI Technical Paper Chairs
Wayne State University, USA

Ergun Akleman

SMI Communication Chairs
Texas A&M University, USA

Silvia Biasotti

SMI Communication Chairs
CNR-IMATI, Italy

Yang Liu

SMI Communication Chairs
Microsoft Research Asia, China

Qiang Zou

Local Coordinator (Area Chair)
Zhejiang University, China

Jinlan Xu

Local Coordinator (Area Chair)
Hangzhou Dianzi University, China
  • Rinat Abdrashitov (Epic Games)
  • Valery Adzhiev (Bournemouth University)
  • Gill Barequet (Technion Israel Institute of Technology)
  • Loic Barthe (Université de Toulouse)
  • Alexander Belyaev (Heriot-Watt University)
  • Pengbo Bo (Harbin Institute of Technology)
  • Adrien Bousseau (INRIA)
  • Juan Cao (Xiameng University)
  • Nathan Carr (Adobe)
  • Chiara Eva Catalano (IMATI)
  • Raphaelle Chaine (Université of Lyon)
  • Zhonggui Chen (Xiameng University)
  • Renjie Chen (University of Science and Technology of China)
  • Edward Chien (MIT)
  • Leila DeFloriani (University of Maryland Institute)
  • Lorenzo Diazzi (CNR-IMATI)
  • Dong Du (Nanjing University of Science and Technology)
  • Ye Duan (University of Missouri)
  • Gershon Elber (Technion Israel Institute of Technology)
  • John A. Evans (University of Colorado Boulder)
  • Xiaoming Fu (University of Science and Technology of China)
  • Eric Galin (University of Lyon)
  • Lin Gao (Chinese Academy of Sciences)
  • Yotam Gingold (George Mason University)
  • Daniela Giorgi (ISTI-CNR)
  • Eric Guerin (INSA de Lyon)
  • Xiaohu Guo (The University of Texas at Dallas)
  • Stefanie Hahmann (INRIA)
  • Fazhi He (Wuhan University)
  • Ying He (Nanyang Technological University)
  • Franck Hetroy-Wheeler (University of Strasbourg)
  • Kai Hormann (Università della svizzera italiana)
  • Jing Hua (Wayne State University)
  • Haibin Huang (Kwai Inc.)
  • Jin Huang (Zhejiang University)
  • Ioannis Ivrissimtzis (Durham University)
  • Tao Ju (Washington University in St. Louis, USA)
  • Bert Jüttler (Johannes Kepler University)
  • Takashi Kanai (University of Tokyo)
  • Hongmei Kang (Soochow University)
  • John Keyser (Texas A&M University)
  • Hamid Laga (Murdoch University)
  • Na Lei (Dalian University of Technology)
  • Xin Li (Texas A&M University)
  • Lei Li (Technical University of Munich)
  • Zhouhui Lian (Peking University)
  • Peter Lindstrom (Lawrence Livermore National Laboratory)
  • Ligang Liu (University of Science and Technology of China)
  • Chongyang Ma (ByteDance)
  • Luigi Malomo (ISTI-CNR)
  • Claudio Mancinelli (Autodesk)
  • Martin Marinov (RWTH Aachen University)
  • Nicolas Mellado (CRNS-IRIT)
  • Serena Morigi (University of Bologna)
  • Ramanathan Muthuganapathy (Indian Institute of Technology Madras)
  • Ahmad Nasri (Boulder Graphics LLC)
  • Stefan Ohrhallinger (Vienna University of Technology)
  • Yutaka Ohtake (University of Tokyo)
  • Maodong Pan (Nanjing University of Aeronautics and Astronautics)
  • Amal Dev Parakkat (Institut Polytechnique de Paris)
  • Giusepp Patanè (CNR-IMATI)
  • Jorg Peters (University of Florida)
  • Konrad Polthier (Freie Universitat Berlin)
  • Hong Qin (Stony Brook University)
  • Chiara Romanengo (CNR-IMATI)
  • Carlo Sequin (UC Berkeley)
  • Liyong Shen (Chinese Academy of Sciences)
  • Wanqiang Shen (Jiangnan University)
  • Suzanne Shontz (University of Kansas)
  • Zhenyu Shu (Zhejiang University)
  • Keke Tang (Guangzhou University)
  • Daniel Thalmann (Swiss Federal Institute of Technology)
  • Yiying Tong (Michigan State University)
  • Georg Umlauf (HTWG Konstanz)
  • Remco Veltkamp (Utrecht University)
  • Etienne Vouga (University of Texas at Austin)
  • Pengshuai Wang (Peking University)
  • Weiming Wang (Nanjing Unviersity of Science and Technology)
  • Charlie C.L. Wang (The University of Manchester)
  • Wei Wang (Beihang University)
  • Kui Wu (Tencent North America)
  • Kai Xu (National University of Defense Technology)
  • Gang Xu (Hangzhou Dianzi University)
  • Yongjie Jessica Zhang (Carnegie Mellon University)
  • Chungang Zhu (Dalian University of Technology)
  • Qiang Zou (Zhejiang University)

Submission

SPM

Accepted full-length papers will be published in the journal of Computer-Aided Design (Elsevier) after a rigorous two-stage double-blind review process. Papers should be formatted according to the style guidelines for Computer-Aided Design and should not exceed 12 pages, including figures and references. We strongly recommend using the LaTeX template to format your paper, but we also accept papers formatted by MS Word according to the style guidelines for Computer-Aided Design (Elsevier). The file must be submitted in PDF format using the EasyChair website.

通过严格的两阶段双盲评审程序,接受的全文论文将发表在《计算机辅助设计》杂志(Elsevier)上。论文的格式应符合《计算机辅助设计》风格指南,不得超过 12 页,包括图表和参考文献。我们强烈建议使用 LaTeX 模板来格式化您的论文,但也接受根据《计算机辅助设计》(Elsevier)样式指南使用 MS Word 格式化的稿件。论文必须通过 EasyChair 网站以 PDF 格式提交。

Topics of interest include, but are not limited to:

3D fabrication/printing/manufacturing technologies

Anisotropic/heterogeneous/composite materials

Applied algebraic and differential geometry

Applied computational geometry and topology

Conceptual, collaborative, and distributed design

Computational fabrication

Curve, surface, and manifold modeling

Dimensioning and tolerancing

Feature modeling, recognition, and understanding

Geometric algorithms

Geometric and topological representations

Geometric constraint solving and parametric modeling

Geometric interpolation and smoothing

Geometry generation and processing

Geometry compression and transmission

Isogeometric analysis

Meshing and mesh optimization

Multi-resolution modeling

Numerical analysis of geometric algorithms

Physically-based modeling and simulation

Product data exchange, standards, and interoperability

Reverse engineering/reconstruction of surfaces/solids

Robustness and validity of geometric computations

Shape modeling, synthesis and analysis


SMI

Submissions should be anonymous, via EasyChair, previously unpublished, original results that are not simultaneously submitted elsewhere. Submissions should be formatted according to the style guidelines for the Computers & Graphics journal and should not exceed 12 pages, including figures and references. We strongly recommend using the LaTeX template to format your paper. We also accept papers formatted by MS Word according to the style guidelines for Computers & Graphics. The file must be exported to a PDF file for the first round of submission. For format details, please refer to the Computers & Graphics Guide for Authors. The SMI 2025 conference will use a double-blind review process.

提交应该是匿名的,通过 EasyChair,以前未发布的、未同时提交到其他地方的原始结果。提交文件的格式应符合《计算机与图形杂志》的风格指南,且不得超过 12 页,包括图表和参考资料。我们强烈建议使用 LaTeX 模板来格式化您的论文。我们也接受使用 MS Word 编写并遵循《计算机与图形》风格指南的稿件。第一轮提交时,必须将文件导出为 PDF 格式。有关格式详细信息,请参阅《计算机与图形》作者指南。SMI 2025 会议将采用双盲评审程序。

Topics of interest include, but are not limited to:

AR/VR environments

Acquisition and reconstruction

Behavior and animation models

Compression and streaming

Computational topology

Correspondence and registration

Curves and surfaces

Digital fabrication and 3D printing

Geometric Deep Learning

Exploration of shape collections

Feature extraction and classification

Healing and resampling

Implicit surfaces

Interactive modeling, design and editing

Learning techniques for shape modeling

Medial and skeletal representations

Parametric and procedural models

Segmentation

Semantics of shapes

Shape analysis and synthesis

Shape modeling applications (product design, biomedicine, GIS, geoscience, art, education and training, cultural heritage, gaming, and others)

Shape statistics

Shape transformation and deformation

Simulation

Sketching and 3D input modalities

Triangle and polygonal meshes

3D Digital Twins

3D retrieval


Any accepted paper is required to have at least one registered author to attend and present the paper at the conference. As the Replicability Stamp is a prerequisite for SMI best paper nomination, please consider participating in the Replicability Stamp Initiative if your paper gets accepted.

任何被接受的论文都必须至少有一位注册作者出席会议并在会上发表论文。由于可复现性是 SMI 最佳论文提名的先决条件,如果您的论文被接收,请考虑参与可复现性认证计划。

Keynote

Robust Quality Delaunay Mesh Generation for Numerical Simulations of Multi-physics problems in EDA



Abstract:
Mesh generation is the prerequisite of numerical methods (e.g., Finite Element Analysis FEA, Computational Fluid Dynamics CFD). Multi-physics analysis in the Electronic Design Automation (EDA) field aims to simulate the behavior of electronic systems (chips, packages, PCBs) under the coupled effects of electrical, thermal, and mechanical fields. It poses tremendous challenges for mesh generation. There are many theoretical and practical difficulties in automatically generating good quality and adaptive meshes in 3d. This talk focuses on a methodology which has a rigorous theoretical background, the well-known Delaunay criterion. We will present the state-of-the-art development on automatic generation of high-quality unstructured surface and volume Delaunay meshes for arbitrarily complex and challenging EDA geometries. In addition, we will discuss practical techniques for achieving robust and efficient implementations.

Biography:
Hang Si is a Professor at the School of Software, Dalian University of Technology (DLUT). He earned a Bachelor's degree in Electronic Engineering from Hangzhou University (now Zhejiang University) in 1994, a Master's degree in Computer Science from Zhejiang University in 2002, and a Ph.D. in Mathematics from Technische Universität Berlin (TU Berlin), Germany in 2008. From 2002 to 2020, he worked as a Senior Researcher at the Weierstrass Institute for Applied Analysis and Stochastics (WIAS) in Berlin, Germany. He worked as a Senior Software Architect at Cadence Design Systems Inc, San Jose, CA, U.S.A from 2020 to 2024. Prof. Si's research focuses on solving practical engineering problems through rigorous mathematical theories. He spent over 20 years conducting algorithmic research on mesh generation. His major achievement is the open-source 3D tetrahedral mesh generation software TetGen (http://www.tetgen.org). This software is widely used in engineering and academic research. It has also been commercially licensed to numerous companies, generating over $1 million in licensing fees. For this work, he received the SGP Software Award in 2012. At Cadence, he led a team and developed an unstructured mesh generation engine, which made a foundational contribution to the company's electromagnetic field and thermal analysis software, earning customer trust in the market and generating significant commercial profits. Upon returning to China, Prof. Si will dedicate himself to developing next-generation mesh generation algorithms and software. These will be closely integrated with numerical methods to solve large-scale engineering challenges across various fields.

Abstract:
网格生成是数值计算方法(如有限元分析 Finite Element Analysis, FEA、计算流体力学 Computational Fluid Dynamics, CFD)的前提条件。 电子设计自动化 (Electronic Design Automation, EDA) 领域中的多物理场分析旨在模拟电子系统(包括芯片、封装与印刷电路板 PCBs)在电、热、机械场耦合作用下的行为,这对网格生成提出了巨大的挑战。 在三维空间中,如何自动生成高质量、且具备自适应能力的网格存在诸多理论与实践上的难题。本报告将聚焦于一种具有严谨数学理论基础的方法——著名的 Delaunay 判据。我们将介绍在针对任意复杂且具有挑战性的 EDA 几何模型上,自动生成高质量非结构化曲面与体积 Delaunay 网格的最新研究进展。此外,还将讨论实现过程中确保算法稳健性与计算效率的实用技术。

Biography:
斯杭,现任大连理工大学软件学院教授。他于1994年获得杭州大学(现浙江大学)电子工程学士学位,2002年获得浙江大学计算机科学硕士学位,2008年获得德国柏林工业大学(Technische Universität Berlin, TU Berlin)数学博士学位。2002年至2020年,他在德国柏林魏尔施特拉斯应用分析与随机研究所(Weierstrass Institute for Applied Analysis and Stochastics, WIAS)担任高级研究员。2020年至2024年,他在美国加州圣何塞的楷登电子设计自动化公司(Cadence Design Systems Inc.)担任高级软件架构师。 斯教授的研究致力于通过严谨的数学理论解决工程实际问题。他在网格生成算法研究领域深耕二十余年,其主要成果是开源三维四面体网格生成软件 TetGen(http://www.tetgen.org)。该软件已被广泛应用于工程与学术研究,并获得众多公司的商业授权,累计创造超百万美元的许可收益。凭借这一工作,他于2012年获得 SGP Software Award。在楷登公司工作期间,他带领团队开发了一套非结构化网格生成引擎,为公司的电磁场与热分析软件奠定了核心基础,赢得了市场的客户信任,并创造了可观的商业价值。 回国后,斯教授将致力于研发新一代网格生成算法与软件,使其与数值方法深度结合,以解决各领域的大规模工程挑战。


Integrating Manufacturing into Design Optimization: Why and How



Abstract:
For decades, the community has pursued the vision of unifying design and manufacturing optimization. A central question remains: how can we explicitly integrate manufacturing factors into design optimization? In this talk, I will present several of our recent research efforts toward this goal, leveraging neural implicit representations to embed manufacturability directly within the optimization process. In particular, I will highlight a computational framework that jointly optimizes structural topology, curved layers, and fiber orientations, enabling the fabrication of high-strength yet manufacturable composite structures. My talk will conclude with a counterexample: a new hybrid manufacturing approach capable of fabricating any topology-optimized shape without support structures, but applicable only to materials with isotropic mechanical properties. This highlights the delicate trade-off between maximizing design freedom and ensuring manufacturability.

Biography:
Charlie C. L. Wang is a Chair Professor of Smart Manufacturing at the University of Manchester (UoM). Before joining UoM in 2020, he worked as a Professor and Chair of Advanced Manufacturing at Delft University of Technology, The Netherlands (2016) and as a Professor (2015) / Associate Professor (2009) / Assistant Professor (2003) of Mechanical and Automation Engineering at the Chinese University of Hong Kong. He received his B.Eng. degree (1998) in mechatronics engineering from Huazhong University of Science and Technology and his Ph.D. degree (2002) in mechanical engineering from Hong Kong University of Science and Technology (HKUST). Prof. Wang is well-known for his research in computational design and manufacturing with a focus on geometric computing, optimisation, and modeling. He was the recipient of several awards, including the ASME CIE Excellence in Research Award (2016), the ASME CIE Young Engineer Award (2009), eight Best Paper Awards, five project-oriented technology innovation awards and three teaching awards. He was elected to be a Fellow of American Society of Mechanical Engineers (ASME) in 2013.

Abstract:
数十年来,学术界与工业界一直追求设计与制造优化一体化的愿景。但一个核心问题仍然存在:如何在设计优化过程中显式地融入制造因素?在本次报告中,我将介绍我们近年来为实现这一目标所开展的一系列研究工作,重点利用神经隐式表示 (neural implicit representations),将可制造性直接嵌入优化流程中。特别地,我将展示一个计算框架,该框架能够同时优化结构拓扑、曲面层叠及纤维取向,从而实现高强度且可制造的复合材料结构的设计与制造。此外,我的报告将以一个反例作为总结:一种全新的混合制造方法能够在无需支撑结构的情况下制造任意拓扑优化形状,但仅适用于各向同性力学性能的材料。这一案例凸显了在最大化设计自由度与保障可制造性之间的微妙权衡。

Biography:
Charlie C. L. Wang教授现任英国曼彻斯特大学 (University of Manchester, UoM) 智能制造讲席教授。2020年加入曼彻斯特大学之前,他曾任荷兰代尔夫特理工大学 (Delft University of Technology) 高级制造讲席教授(2016),并于2003至2015年间在香港中文大学机械与自动化工程学系担任助理教授、副教授及教授。 Wang教授1998年于华中科技大学获机电工程学士学位,2002年于香港科技大学 (HKUST) 获机械工程博士学位。他以在计算设计与制造领域的研究而知名,研究方向聚焦于几何计算、优化与建模。他曾获多项荣誉,包括美国机械工程师学会计算机与信息工程分部 (ASME CIE) 研究卓越奖(2016)、ASME CIE青年工程师奖(2009)、八项最佳论文奖、五项面向项目的技术创新奖以及三项教学奖。2013年,他当选为美国机械工程师学会会士 (ASME Fellow)。


Volumetric Representations: the Geometric Modeling of the Next Generation



Abstract:
The needs of modern (additive) manufacturing (AM) technologies can be satisfied no longer by boundary representations (B-reps), as AM requires the representation and manipulation of interior fields and (graded) materials as well. Further, while the need for a tight coupling between design and analysis has been recognized as crucial almost since geometric modeling (GM) has been conceived, contemporary GM systems only offer a loose link between the two, if at all. For about half a century, (trimmed) Non Uniform Rational B-spline (NURBs) surfaces has been the B-rep of choice for virtually all the GM industry. Fundamentally, B-rep GM has evolved little during this period. In this talk, we will explore an extended (trimmed) NURBs volumetric representation (V-rep) that successfully confronts existing and anticipated design, analysis, and manufacturing foreseen challenges. We have extended all fundamental B-rep GM operations, such as primitive and surface constructors and Boolean operations, to trimmed trivariate V-reps. This enables the much-needed tight link to (Isogeometric) analysis (IGA) on one hand and the full support of (heterogeneous, porous, and anisotropic) additive manufacturing on the other. Special V-rep capabilities toward the support of modern AM and the support of IGA will also be presented, that enable robust queries over V-reps, including precise contact analysis, maximal penetration depth, and accurate integration over trimmed domains. Examples and applications of V-rep GM, including AM and (heterogeneous) synthesis of lattices will also be demonstrated.

Biography:
Gershon Elber is a professor in the Computer Science Department, Technion, Israel. His research interests span computer aided geometric design and computer graphics. He is now the head of the Technion's Additive Manufacturing Center. Prof. Elber has served on the editorial board of the Computer Aided Design, Computer Graphics Forum, The Visual Computer, Graphical Models, and the International Journal of Computational Geometry & Applications and has served in many geometric modeling-related program committees of conferences, as well as their chair. He has published over 250 papers in international conferences and journals, received 15 best paper awards, and presented a dozen keynote plenary talks. Prof. Elber received the John Gregory Memorial Award, 2011, in "Appreciation for Outstanding Contributions in Geometric Modeling", the Solid Modeling Association pioneers award in 2016, the Bezier award in 2019, and the Kunii award in 2024.

Abstract:
现代增材制造(Additive Manufacturing, AM)技术的需求已无法通过传统的边界表示(Boundary Representations, B-reps)来满足,因为 AM 不仅要求对几何边界进行表示与操作,还需要对内部场以及梯度材料(graded materials)进行建模与操控。此外,尽管自几何建模(Geometric Modeling, GM)诞生以来,设计与分析的紧密耦合一直被认为至关重要,但当代 GM 系统几乎只提供了极为松散的连接。在过去半个世纪中,裁剪非均匀有理 B 样条(trimmed Non-Uniform Rational B-spline, NURBs)曲面几乎一直是几何建模行业的主流边界表示。然而,从根本上看,B-rep GM 在此期间几乎没有实质性演进。 在本次报告中,我们将探讨一种扩展的裁剪 NURBs 体表示(Volumetric Representation, V-rep),它能够有效应对现有及未来设计、分析与制造中的挑战。我们已将所有基本的 B-rep GM 操作(如几何基元与曲面构造器、布尔运算等)扩展至裁剪三变量 V-rep,从而一方面实现了与同构分析(Isogeometric Analysis, IGA)所需的紧密链接,另一方面全面支持(异质、多孔、各向异性)增材制造。 此外,本报告还将介绍若干面向现代 AM 与 IGA 的特殊 V-rep 功能,例如在 V-rep 上实现稳健的几何查询,包括精确接触分析、最大穿透深度计算以及对裁剪域的高精度积分。最后,我们将展示 V-rep GM 的实例与应用,包括 AM 及(异质化的)晶格结构合成。

Biography:
Gershon Elber 现任以色列理工学院(Technion – Israel Institute of Technology)计算机科学系教授,并担任该校增材制造中心主任。他的研究兴趣涵盖计算机辅助几何设计与计算机图形学。 Elber 教授曾任多个国际期刊的编委,包括 Computer Aided Design、Computer Graphics Forum、The Visual Computer、Graphical Models、International Journal of Computational Geometry & Applications,并多次在几何建模相关会议的程序委员会中担任成员及主席。他已在国际会议与期刊上发表论文超过 250 篇,获得 15 项最佳论文奖,并作过十余场大会特邀报告。 Elber 教授曾荣获多项国际大奖,包括 2011 年 John Gregory Memorial Award(表彰其在几何建模领域的杰出贡献)、2016 年 Solid Modeling Association Pioneers Award、2019 年 Bezier Award 以及 2024 年 Kunii Award。


The Schedule

Conference Registration : October 29

Official Opening of the Conference : October 29 afternoon


Registration Guide

Registration is required to participate in SPM 2025/SMI 2025. If you are interested in participating in SPM 2025/SMI 2025, please click on the link to register directly through the registration system.For SPM 2025 or SMI 2025, you only need to register one of them.According to Chinese policy, non-mainland participants must complete registration by October 15.

参加 SPM 2025/SMI 2025 必须注册,有兴趣参加 SPM 2025/SMI 2025 的代表,请直接点击链接通过注册系统注册。对于SPM 2025或者SMI 2025,只需要注册其中一个便可。根据中国政策,非大陆参会者需要10月15日前完成注册。
Plan Name Member of Asia Graphics, CCF, or CSIAM Non-member of Asia Graphics, CCF, or CSIAM
Early-Bird (By Sept. 20, 2025) Full 3000 RMB (420 USD) 3800 RMB (530 USD)
Student 2000 RMB(280 USD) 2500 RMB (350 USD)
Normal (After Sept. 20, 2025) Full 3500 RMB (490 USD) 4000 RMB (560 USD)
Student 2200 RMB (310 USD) 2600 RMB (370 USD)
China has introduced visa exemptions for visitors from selected countries (listed below). If you have any issues with your visa application, please check the Chinese Visa Application Service Center website to confirm your eligibility. https://www.visaforchina.cn/

中国对部分国家持普通护照人员实行免签政策。请根据您的护照国籍参考下列名单,并提前向中国驻贵国使领馆确认是否符合相关免签条件,以免影响签证办理。有关签证的详细信息可参阅中国签证申请服务中心。

National flag(国旗) English name 中文名称
BruneiBrunei文莱
FranceFrance法国
GermanyGermany德国
ItalyItaly意大利
SpainSpain西班牙
NetherlandsNetherlands荷兰
MalaysiaMalaysia马来西亚
SwitzerlandSwitzerland瑞士
IrelandIreland爱尔兰
HungaryHungary匈牙利
AustriaAustria奥地利
BelgiumBelgium比利时
LuxembourgLuxembourg卢森堡
New ZealandNew Zealand新西兰
AustraliaAustralia澳大利亚
PolandPoland波兰
PortugalPortugal葡萄牙
GreeceGreece希腊
CyprusCyprus塞浦路斯
SloveniaSlovenia斯洛文尼亚
SlovakiaSlovakia斯洛伐克
NorwayNorway挪威
FinlandFinland芬兰
DenmarkDenmark丹麦
IcelandIceland冰岛
AndorraAndorra安道尔
MonacoMonaco摩纳哥
LiechtensteinLiechtenstein列支敦士登
South KoreaSouth Korea韩国
BulgariaBulgaria保加利亚
RomaniaRomania罗马尼亚
CroatiaCroatia克罗地亚
MontenegroMontenegro黑山
North MacedoniaNorth Macedonia北马其顿
MaltaMalta马耳他
ArmeniaArmenia亚美尼亚
LatviaLatvia拉脱维亚
JapanJapan日本
BrazilBrazil巴西
ArgentinaArgentina阿根廷
ChileChile智利
PeruPeru秘鲁
UruguayUruguay乌拉圭
Saudi ArabiaSaudi Arabia沙特
OmanOman阿曼
KuwaitKuwait科威特
BahrainBahrain巴林

Hotel

Hangzhou Dragon Hotel (Conference Hotel)

杭州黄龙饭店 (主会场)

We recommend that non-Chinese participants book the Dragon Hotel.
Address: No. 120, Shuguang Road, Xihu District, Hangzhou    Tel: 0571-87998833
Click hotel reservation link https://opera.dragon-hotel.com For hotel reservation, the Corporate Code is SPM-SMI.
Please be sure to enter the Corporate Code before checking room availability.

杭州黄龙饭店    地址:杭州市西湖区曙光路120号    电话:0571-87998833
点击酒店预订链接 https://opera.dragon-hotel.com 进行酒店预订,会议协议代码为 SPM-SMI
请务必输入协议代码再查看房态!


Other accommodation options

Hangzhou the Westlake Atour Music Hotel(杭州西湖亚朵音乐酒店)

Hangzhou the Westlake Atour Music Hotel is situated on Yugu Road, Xihu District, right in the heart of Hangzhou. As the first platform-based music community-themed hotel under the Atour Group, it stands out with its unique positioning. Hangzhou the Westlake Atour Music Hotel, a "Super-class" hotel under Atour, has achieved a full-scale upgrade in terms of location selection, spatial facilities, and value-added services. It offers: an elegant and comfortable co-working lobby integrated with music and coffee; the "Fourth Space" featuring music-themed guest rooms; private conference halls for business events and exhibitions; a restaurant with a comprehensive dining model; a LIVE HOUSE hosting various cutting-edge and trendy music events; as well as warm, humanistic, and high-quality services.

Booking hotel links:https://hotels.ctrip.com/hotels/3690288.html

杭州西湖亚朵音乐酒店位于西湖区玉古路是杭城市心地带。该酒店为亚朵集团旗下第一家平台型音乐社区主题酒店。杭州西湖亚朵S音乐酒店为亚朵旗下Super级酒店,从酒店选址、空间设施、增值服务等做了全方位的升级,提供与音乐、咖啡结合的优雅舒适共享办公大堂;特色音乐主题客房第四空间;商务会展私密会议大厅;全方位餐饮模式餐厅;各类潮流新锐音乐活动LIVE HOUSE;人文温暖高品质服务。

预订链接:https://hotels.ctrip.com/hotels/3690288.html


Twin Beds Room双床房

King Bed Room大床房


Ji Hotel (Hangzhou Huanglong)(全季酒店(杭州黄龙店))

Ji Hotel is located at No. 41 Zheda Road, Xihu District, with convenient transportation. It is a 4-minute walk from the Yuquan Campus of Zhejiang University, a 15-minute walk from the Botanical Garden, and a 15-20 minute walk from the West Lake (to the Qu Yuan Feng He scenic spot).The hotel's front desk, restaurant, gym, and laundry room are all on the 1st floor, and guest rooms are on the 2nd to 5th floors. All rooms are equipped with a 65-inch smart TV and a mini-fridge, with WIFI coverage throughout the entire room. Free access to the laundry room and gym is available 24 hours a day.

Booking hotel links:https://hotels.ctrip.com/hotels/975704.html

全季酒店位于西湖区浙大路41号,交通便利,酒店距离浙大玉泉校区步行4分钟,距离植物园步行15分钟,距离西湖步行15-20分钟到曲院风荷景点。酒店前台、餐厅、健身房和洗衣房均在1楼,客房在2-5层,所有房间均有65寸无线电视,小冰箱,全屋覆盖WIFI,24小时提供免费洗衣房、健身房。

预订链接:https://hotels.ctrip.com/hotels/975704.html


Twin Beds Room双床房

King Bed Room大床房


Traffic

From Airport

1) Shanghai Hongqiao International Airport → Hangzhou Dragon Hotel
Walk to Hongqiao Railway Station (10 min).
Take a high-speed train to Hangzhou East Railway Station (50–70 min, 75–120 CNY).
From Hangzhou East, take Metro Line 1 to the West Lake Cultural Square Station, then transfer to Line 3 towards Huanglong Cave Station(30-40 min, 4 CNY). Or take the taxi/ride-hailing to reach Hangzhou Dragon Hotel(25-30 min, 20-30 CNY).

2) Shanghai Pudong International Airport → Hangzhou Dragon Hotel
Walk to Pudong Airport Bus Station, take the airport bus to Hangzhoudong Railway Station (2.5-3 h, 130 CNY).
From Hangzhou East, take Metro Line 1 to the West Lake Cultural Square Station, then transfer to Line 3 towards Huanglong Cave Station(30-40 min, 4 CNY). Or take the taxi/ride-hailing to reach Hangzhou Dragon Hotel(25-30 min, 20-30 CNY).

3) Hangzhou Xiaoshan International Airport → Hangzhou Dragon Hotel
Take Metro Line 19 to the West Lake Cultural Square Station, then transfer to Line 3 towards Huanglong Cave Station(60-70 min, 7 CNY). Or take the taxi/ride-hailing to reach Hangzhou Dragon Hotel(60-80 min, 70-100 CNY).

1) 上海虹桥国际机场 → 杭州黄龙饭店
步行至虹桥火车站(10分钟)。
乘坐高铁至杭州东站(50-70分钟,75-120元)。
杭州东站乘坐地铁1号线至西湖文化广场站,再换乘3号线至黄龙洞站(30-40分钟,4元)。或者乘坐出租车/叫车服务到达杭州黄龙饭店(25-30分钟,20-30元)。

2) 上海浦东国际机场 → 杭州黄龙饭店
步行至浦东机场汽车站,乘坐机场巴士至杭州东火车站(2.5-3小时,130元)。
杭州东站乘坐地铁1号线至西湖文化广场站,再换乘3号线至黄龙洞站(30-40分钟,4元)。或者乘坐出租车/叫车服务到达杭州黄龙饭店(25-30分钟,20-30元)。

3) 杭州萧山国际机场 → 杭州黄龙饭店
乘坐地铁19号线至西湖文化广场站,转3号线至黄龙洞站(60-70分钟,7元)。或者乘坐出租车/叫车服务到达杭州黄龙饭店(60-80分钟,70-100元)。

From the Railway Station

1) Hangzhoudong Railway Station → Hangzhou Dragon Hotel
Take Metro Line 1 to the West Lake Cultural Square Station, then transfer to Line 3 towards Huanglong Cave Station(30-40 min, 4 CNY). Or take the taxi/ride-hailing to reach Hangzhou Dragon Hotel(25-30 min, 20-30 CNY).

2) Hangzhouxi Railway Station → Hangzhou Dragon Hotel
Take Metro Line 3 towards Huanglong Cave Station(50-60 min, 6 CNY). Or take the taxi/ride-hailing to reach Hangzhou Dragon Hotel(40-50 min, 35-45 CNY).

3) Hangzhou Railway Station(Chengzhan Railway Station) → Hangzhou Dragon Hotel
Take Metro Line 1 to the Wulin Square Station, then transfer to Line 3 towards Huanglong Cave Station(30-35 min, 3 CNY). Or take the taxi/ride-hailing to reach Hangzhou Dragon Hotel(40-50 min, 35-45 CNY).

1) 杭州东火车站 → 杭州黄龙饭店
乘坐地铁1号线至西湖文化广场站,再转3号线至黄龙洞站(30-40分钟,4元)。或者乘坐出租车/叫车服务到达杭州黄龙饭店(25-30分钟,20-30元)。

2) 杭州西火车站 → 杭州黄龙饭店
乘坐地铁3号线至黄龙洞站(50-60分钟,6元)。或者乘坐出租车/叫车服务到达杭州黄龙饭店(40-50分钟,35-45元)。

3) 杭州火车站(城站站)→ 杭州黄龙饭店
乘坐地铁1号线至武林广场站,再换乘3号线至黄龙洞站(30-35分钟,3元)。或者乘坐出租车/叫车服务到达杭州黄龙饭店(40-50分钟,35-45元)。